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Applications
The focused laser beam acts like a knife to remove surface material from an object gradually. This is a non-contact process so that the object will not be damaged. The area affected by the laser is extremely small. Laser processing is so precise that its performance cannot be matched by traditional processing methods.- Electronic Industries
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MethodApplicationRecommendMarking
- electric materials,IC, etc.
- PC keyboard marking
Welding- Applied to mobile phone batteries,sensors,
electronic components ,etc.
Cutting- silicon wafer cutting
- Metal,metalloid,die-board cutting
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MethodApplicationRecommendCutting
- Metal cutting(carbonsteel,stainless steel)
- Die-board Processing
- Apparel,Luggage,Bags
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MethodApplicationRecommend
- Marking
- marking on jeans,unprocessed fabric,completed clothing
- button marking and cutting
- marking on leather
- Cutting
- leather cutting
- fabric cutting
- Packaging Industries
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MethodApplicationRecommend
Marking serial-number marking,production date marking - Solar Industries
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MethodApplicationRecommend
Cutting solar silicon wafer cutting - Jewelry Industries
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MethodApplicationRecommend
Welding clocks,watches,jewelry welding Marking marking on metal,crafts Cutting organic glass cutting General Laser Cutter Sub-surface Engraving sub-surface engraving - hardware Industries
- MethodApplicationRecommendWelding
- glasses,crafts
- precision instruments,medical apparatus welding
Marking- precision instruments,medical apparatus marking
- Building materials
- MethodApplicationRecommendCutting
- Ceramic cutting
Marking- marking on building materials,PVC etc..
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